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DATA S H E E T
SOLID TANTALUM CAPACITOR
SV/F SERIES
Surface mount resin molded chip with Built-in fuse, Low blow-out current (2A)
The SV/F series features a built-in fuse to minimize circuit damage from over current by protection with less than a half blow-out current of the former type. This fuse-protected capacitor is suitable for noise absorption applications such as those required for computers, terminals and measuring instruments.
FEATURES
TM Built-in fuse protection (2A) TM High-temperature durability for either wave soldering or reflow soldering applications TM The same excellent performance as NEC's R series TM Wide operating temperature range (-55C to +125C) TM High reliability (Failure rate = 1%/1 000H at 85C, DC rated voltage applied)
DIMENSIONS
L
H
W1
L
W1
Y
Z +
Z -
W2
Z +
Z -
H
W2
[B2 and D2 case]
Case Code B2 C D2 D L 3.50.2 6.00.3 5.80.3 7.30.3 W1 2.80.2 3.20.3 4.60.3 4.30.3 W2 2.30.1 1.80.1 2.40.1 2.40.1
[C and D case]
(Unit : mm) H 1.90.2 2.50.3 3.20.3 2.80.3 Z 0.80.3 1.30.3 1.30.3 1.30.3 Y - 0.4C - 0.5C
MARKING
[C and D case] [B2 and D2 case]
F
Capacitance ( F)
F
1 35 n
10 16 n
Rated voltage (V) Date code Polarity (anode) and mark of built-in fuse
The information in this document is subject to change without notice.
Document No. EC0003EJ3V1DS00 (3rd edition) Date Published June 1996 M CP(K) Printed in Japan
(c)
1992(1996)
SV/F SERIES
PRODUCTION DATE CODE
Month Year 1995 1996 1997 1998 Jan a n A N Feb b p B P Mar c q C Q Apr d r D R May e s E S Jun f t F T Jul g u G U Aug h v H V Sep j w J W Oct k x K X Nov l y L Y Dec m z M Z
Date code will resume beginning in 1999.
PRODUCT LINE-UP AND MARKING CODE
UR (Vdc) Capacitance (F) 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 UR : Rated voltage D2, D D C, D2 B2 B2 C C C D2 D2, D D D2, D D D C D2, D D B2 C D2, D D B2 C D2
10
16
20
25
35 B2
50 C
PART NUMBER SYSTEM
BULK (Packed in poly bag)
SVF B2 1V 105 M
Capacitance tolerance M for 20% Capacitance code in pF First two digits represent significant figures. Third digit specifies number of zeros to follow. Rated voltage 1H 1V 1E 1D 1C 1A Case code SVF series Tape and reel : 50 V : 35 V : 25 V : 20 V : 16 V : 10 V
TAPE AND REEL
TE SVFB21V105M 8 R
Packing orientation Part number of bulk (see left) R : (Standard) Orientation Tape
Feed direction
Polarity mark
L : (Non-Standard) Orientation Feed direction Tape
Polarity mark
Tape width 8 mm for B2 case 12 mm for C, D and D2 case
2
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
SPECIFICATIONS
No. 1 2 3 4 5 6 7 8 Items Operating Temp. Range Rated Voltage Surge Voltage Derated Voltage Capacitance Range Capacitance Tolerance Leakage Current Tangent of loss angle 10 13 6.3 16 20 10 20 26 13 Specifications -55 to +125C 25 33 16 1.0 to 4.7 F 20% 0.01 CV (A) or 0.5 A whichever is greater 1.0 to 4.7 F : 0.04 max. 6.8 to 47 F : 0.06 max. : 5% Tangent of loss angle : Initial requirement Leakage Current : Initial requirement -55C
0 - 12
Test Conditions Over 85C, applied voltage shall be derated on the basis of the Derated Voltage at 125C specified in this table item no.4 50 65 32 Vdc Vdc Vdc up to 85C up to 85C at 125C at 120 Hz at 120 Hz 5 min. after rated voltage applied at 25C, 120 Hz at 85C Surge voltage for 30 sec. (Rs = 1 k) Discharge for 4 min. 30 sec. 1 000 cycles Step1 Step2 Step3 Step4 Step5 Step6 : : : : : : +25C -55C +25C +85C +125C +25C
35 46 22
C /C
9
Surge Voltage Resistance Temp.
+85C
+12 0
+125C
+15 0
C /C
10 Characteristics at high and low temperature Tangent of loss angle Leakage Current
%
%
%
1.0 to 4.7 F : 0.08 6.8 to 47 F : 0.10 --
Initial requirement 0.1 CV or 5 A whichever is greater
1.0 to 4.7 F : 0.06 6.8 to 47 F : 0.08 0.125 CV or 6.25 A whichever is greater
11
Repid change of temperature
: 5% Tangent of loss angle : Initial requirement Leakage Current : Initial requirement : 5% C /C Tangent of loss angle : Initial requirement Leakage Current : Initial requirement : 5% C /C Tangent of loss angle : 150% of Intial requirement Leakage Current : Initial requirement : 10% C /C Tangent of loss angle : Initial requirement Leakage Current : 125% of Initial requirement B2 : 2A - 5 sec. max. C : 2A - 10 sec. max. D2, D : 2A - 20 sec. max.
C /C
IEC68-2-14 Test N and IEC68-2-33 Guidance -55 to +125C 5 cycles IEC68-2-58 Test Td Fully immersion to solder at 260C for 5 sec. IEC68-2-3 Test Ca at 40C, 90 to 95% RH, for 500H
12
Resistance to soldering
13
Damp Heat (Steady state)
14
Endurance
at 85C Rated Voltage applied for 2 000 H
15
Fuse Blow-out Characteristics
at 25C
LEGEND CV : Product of capacitance in F and voltage in V C /C : Capacitance change ratio
DATA SHEET EC0003EJ3V1DS00
3
SV/F SERIES
PART NUMBER WITH FUNDAMENTAL PERFORMANCE
Rated Voltage (Vdc) Capacitance (F) 4.7 15 10 15 33 33 47 3.3 4.7 6.8 16 10 15 22 22 33 2.2 4.7 20 10 10 15 22 1.5 3.3 25 6.8 6.8 10 1.0 2.2 35 4.7 4.7 6.8 1.0 50 3.3 Tangent of loss angle max. 0.04 0.06 0.06 0.06 0.06 0.06 0.04 0.04 0.06 0.06 0.06 0.06 0.06 0.06 0.04 0.04 0.06 0.06 0.06 0.06 0.04 0.04 0.06 0.06 0.06 0.04 0.04 0.04 0.04 0.06 0.04 0.04 Leakage Current (A) max. 0.5 1.5 1.5 3.3 3.3 4.7 0.5 0.7 1.0 1.6 2.4 3.5 3.5 5.2 0.5 0.9 2.0 2.0 3.0 4.4 0.5 0.8 1.7 1.7 2.5 0.5 0.7 1.6 1.6 2.3 0.5 1.7
Case Code B2 C D2 D2 D D B2 C C C D2 D2 D D B2 C D2 D D D B2 C D2 D D B2 C D2 D D C D2
Part Number SVFB21A475M SVFC1A156M SVFD21A156M SVFD21A336M SVFD1A336M SVFD1A476M SVFB21C335M SVFC1C475M SVFC1C685M SVFC1C106M SVFD21C156M SVFD21C226M SVFD1C226M SVFD1C336M SVFB21D225M SVFC1D475M SVFD21D106M SVFD1D106M SVFD1D156M SVFD1D226M SVFB21E155M SVFC1E335M SVFD21E685M SVFD1E685M SVFD1E106M SVFB21V105M SVFC1V225M SVFD21V475M SVFD1V475M SVFD1V685M SVFC1H105M SVFD21H335M
4
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
TAPE AND REEL SPECIFICATION
[Carrier Tape Specification and Packaging Quantity]
sprocket hole D0 embossed cavity
A0
F
t K feed direction
E B0
P1 P2 P0
W
(Unit : mm) Case Code B2 C D2 D A00.2 3.3 3.7 5.1 4.8 B00.2 3.8 6.4 6.2 7.7 W0.3 8.0 12.0 12.0 12.0 F0.05 3.5 5.5 5.5 5.5 E0.1 1.75 1.75 1.75 1.75 P10.1 4.0 8.0 8.0 8.0 P20.05 2.0 2.0 2.0 2.0
Case Code B2 C D2 D
P00.1 4.0 4.0 4.0 4.0
D0+0.1 0
K0.2 2.1 3.0 3.6 3.3
t 0.2 0.3 0.4 0.3
Q'ty/Reel 2 000 500 500 500
1.5 1.5 1.5 1.5
[Reel Specification]
W1 B
D
N
C
R
W2
A
(Unit : mm) Tape width 8 12 A N C D B 200.5 20 0.5 W1 10.01.0 14.51.0 W2 14.5 max. 18.5 max. R 1 1
178 2.0 178 2.0
50 min. 50 min.
13 0.5 13 0.5
210.5 210.5
DATA SHEET EC0003EJ3V1DS00
5
SV/F SERIES
CHARACTERISTICS DATA
Characteristics at high and low temperature
12 8
C / C (%) C / C (%) Tangent of loss angle Leakage Current ( A)
12 8 4 0 -4 -8 -12
4 0 -4 -8 -12
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage Current ( A)
0.1
0.1
0.01
0.01
0.001
25C -55C 25C 85C 125C 25C 35 V/1 F
0.001
25C -55C 25C 85C 125C 25C 10 V/33 F
6
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
Resistance to soldering (immersing at 260C for 10 sec.) (reference data)
6 4
C/ C (%) C/ C (%) Tangent of loss angle Leakage Current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage Current ( A)
0.1
0.1
0.01
0.01
0.001
Initial 35 V/1 F
Final
0.001
Initial 10 V/33 F
Final
DATA SHEET EC0003EJ3V1DS00
7
SV/F SERIES
Damp heat (steady state) (65C, 90 to 95% RH) (reference data)
6 4
C / C (%) C / C (%) Tangent of loss angle Leakage Current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage Current ( A)
0.1
0.1
0.01
0.01
0.001
0h
500 h 35 V/1 F
1 000 h
0.001
0h
500 h 10 V/33 F
1 000 h
8
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
Endurance (85C, Rated Voltage x 1.3 applied) (reference data)
6 4
6 4
C/C (%)
0 -2 -4 -6
C/C (%) Tangent of loss angle Leakage Current ( A)
0h 500 h 35 V/ 1 F 1 000 h
2
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage Current ( A)
0.1
0.1
0.01
0.01
0.001
0.001
0h
500 h 10 V/ 33 F
1 000 h
DATA SHEET EC0003EJ3V1DS00
9
SV/F SERIES
Fuse Blow-out Characteristics
B2 Case
100 100
C Case
100
D2 Case
10
10
10
Time (sec.)
1
1
1
0.1 1 3 Current (A) 5
0.1 1 3 Current (A) 5
0.1 1 3 Current (A) 5
Note : " " is not for blow-out.
Impedance - Frequency characteristics (reference data)
100
10 16 V / 3.3 F
Z ()
16 V / 10 F 1
16 V / 22 F
0.1 1k
10 k
100 k Frequency (Hz)
1M
10 M
10
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage current mode. SV/F series features a built-in-fuse to minimize circuit damage from short circuiting current, but the fuse may not work under some environmental conditions. Refer to the following in detail for reliable circuit design. 1. Expecting Reliability SV/F series tantalum chip capacitors are typically applied to decoupling, blocking, bypassing and filtering. The SV/F series has a very high reliability (low failure rate) in the field. For example, the maximutn field failure rate of an SV/F series capacitor with a DC rated voltage of 16 V is 0.0004% / 1000 hour (4 Fit) at an applied voltage of 5 V, operating temperature of 25C and series resistance of 3 . The maximum failure rate in the field is estimated by the following expression :
3
= 0
V V0
x2
T-T0 10
: Maximum field failure rate 0 : 1% 1000 hour (The failure rate of the SV/ F series at the full DC rated voltage at operating temperature of 85C and series resistance of 3 .) V : Applied voltage in actual use V0 : DC Rated voltage T : Operating temperature in actual use T0 : 85C
120 10 2 7 4 2 100 10 1 7 4 2 90
Operating temperature T (C) Failure rate multiplier F
The nomograph is provided for quick estimation of maximum fieid failure rates. Connect operating temperature T and applied voltage ratio V/V0 of interest with a straight line. The failure rate multiplier F is given at the intersection of this line with the model scale. The failure rate is obtained as = 0 *F. 1.0 0.9 0.8 0.7 0.6 0.5 0.4
Applied voltage ratio V/ V0
110
10 0 7 4 2 10 -1 7 4 2
80
Examples : Given V/V0 = 0.4 and T = 45C, read F = 4 x 10 -3 Hence, = 0.004%/1000 hour (40 Fit) Given V/V0 = 0.3 and T = 25C, read F = 4 x 10 -4 Hence, = 0.0004%/1000 hour (4 Fit)
70
60
10 -2 7 4 2 0.3
50
10 -3 7 4 2 10 -4 7 4 2 10 -5
0.2
40
30
0.1
20
DATA SHEET EC0003EJ3V1DS00
11
SV/F SERIES
2. Built-in-fuse characteristics The briefing of the built-in-fuse characteristics is that: (1) Fuse may not work under some environmental conditions. (2) When the built fuse blows, slight smoking may occur. (3) Fuse blowout data is as shown on page 10. (4) The ESR (equivalent series resistance) is larger than the conventional tantalum capacitor by the built-infuse resistance. Taking notice the above, refer to the following in detail for reliable circuit design. 3. Series resistance As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 / V into circuits where current flow is momentary (switching circuits, charge/discharge circuits, etc). If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to 1/3 of the DC rated voltage.
10
Mafnification of failure
1
0.1 0.1 10 1 Series Resistance ( / V) 100
Figure 1 Effects of series resistance
4. Ripple voltage The sum of DC voltage and peak ripple voltage should not exceed the rated DC rated voltage of the capacitor.
100
Case : B2, @ 25C
100
Case : C, D2,D @ 25C
Ripple voltage (Vrms)
Ripple voltage (Vrms)
10
35 V 25 V 20 V 16 V 10 V
10
50 V 35 V 25 V 20 V 16 V 10 V
1
1
0.1
0.1
1 Frequency (kHz)
10
100
0.1
0.1
1 Frequency (kHz)
10
100
Figure 2 Permissible ripple voltage vs. frequency
Figure 2 is based on an ambient temperature of 25C. For higher temperature, permissible ripple voltage shall be derated as follows. Permissible voltage at 50C = 0.7 x permissible voltage at 25C Permissible voltage at 85C = 0.5 x permissible voltage at 25C Permissible voltage at 125C = 0.3 x permissible voltage at 25C
12
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
5. Reverse voltage Because the capacitors are polarized, reverse voltage should not be applied. If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very short time and should not exceed the following. 10% of DC rated voltage at 25C 5% of DC rated voltage at 85C 1% of DC rated voltage at 125C
6. Mounting
(1) Direct soldering Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering: (a) Temporarily fixing resin Because the SV/F series solid tantalum capacitors are larger in size and subject to more force than the chip multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board may adversely affect the solderability. (b) Pattern design
b
a
c
a
Case B2 C D2 D
a 3.0 4.1 5.4 5.2
b 2.8 2.3 2.9 2.9
c 1.6 2.4 2.4 3.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the pattern is too small, the solderability may be degraded. (c) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature ... 260C max. Time ........................... 5 seconds max. Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. (d) Component layout If many types of chip components are mounted on a printed circuit board which is to be soldered by means of jet soldering, solderability may not be uniform over the entire board depending on the layout and density of the components on the board (also take into consideration generation of flux gas). (e) Flux Use resin-based flux. Do not use flux with strong acidity.
DATA SHEET EC0003EJ3V1DS00
13
SV/F SERIES
(2) Reflow soldering Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate: (a) Pattern design
b
a
c
a
Case B2 C D2 D
a 1.6 2.4 2.4 2.4
b 2.8 2.3 2.9 2.9
c 1.6 2.4 2.4 3.7
The above dimensions are for reference only. Note that if the pattern is too big, the component may not be mounted in place. (b) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature ...... 260C max. Time : 10 seconds max. Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal temperature of the capacitor may rise beyond the surface temperature. (3) Using soldering iron When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is very difficult. However, it is recommended that the following temperature and time be observed to maintain the reliability of the capacitor: lron temperature ...... 300C max. Time ........................... 3 seconds max. Iron power ............... 30 W max.
14
DATA SHEET EC0003EJ3V1DS00
SV/F SERIES
7. Cleaning Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used in combination. The temperature of the organic solvent may vary from room temperature to several 10C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning effect, however, the marking on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the worst case, the component may be functionally damaged. It is therefore recommended that the SV/F series solid tantalum capacitor be cleaned under the following conditions: [Recommended conditions of flux cleaning] (1) Cleaning solvent ......... Chlorosen, isopropyl alcohol (2) Cleaning method ...... Shower cleaning, rinse cleaning, vapor cleaning (3) Cleaning time ............ 5 minutes max. Ultrasonic cleaning This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However, it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning be avoided as much as possible. If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the cleaning. For further information, consult NEC.
8. Others (1) Do not apply excessive vibration and shock to the capacitor. (2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (-5 to +40C) room temperature and (40 to 60% RH) humidity. (3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is deformed, the capacitor may not be automatically mounted by a chip mounter).
DATA SHEET EC0003EJ3V1DS00
15
SV/F SERIES
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its electronic components, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC electronic component, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and antifailure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC electronic component products" means any electronic component product developed or manufactured by or for NEC (as defined above).
DE0202

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